Thermal Properties of Graphene and Carbon Materials: From Physics to Applications in Thermal Management – Now Open for Submissions!

Submit to this Special Topic today View in Browser SUBMIT AN ARTICLE MANAGE MY ALERTS ABOUT THE JOURNAL Applied Physics Letters Call for Papers Special Topic: Thermal Properties of Graphene and Carbon Materials – From Physics to Applications in Thermal Management Submission Deadline: November 30, 2025 LEARN MORE > The discovery of unique heat conduction properties of graphene motivated research focused on the thermal conductivity of graphene, few-layer graphene, and composites with graphene fillers, and at the same time, renewed interest in the thermal properties of other carbon materials such as diamond.  Recent developments suggest that thermal technologies have become the large-scale practical application of graphene – one can now buy commercial thermal paste or epoxies with graphene fillers, or sports jackets with graphene-enhanced textiles for better heat spreading. On the other hand, diamond, which has the highest isotropic thermal conductivity, is a promising material for thermal management in power electronics applications. The acoustic phonon transport and heat conduction in graphene, carbon nanotubes, graphite films, graphite oxide, diamond, and composites with various carbon fillers continue to be exciting topics for fundamental science research. The thermal conductivity of composites and fluids with graphene and other carbon materials has gained a lot of interest. There are new developments in theoretical approaches and experimental techniques for investigating phonons, phonon transport, and thermal properties of carbon materials. The proposed Special Topic will reflect the recent progress in understanding the physics of heat conduction in graphene and carbon materials and capture the exciting developments in the field, which is transitioning from fundamental physics to commercial applications of graphene and carbon materials in thermal management. Guest Editors: Alexander A. Balandin, Johan Liu, Nicola Marzari, and Anirudha V. Sumant Tell Us What You Think! Did you like this email? Yes > No >  Follow us on social media   Copyright © 2025 AIP Publishing. All rights reserved. 1305 Walt Whitman Rd., Melville, NY 11747 You are receiving this email because you have opted-in to receive alerts from us. To guarantee delivery of this email please add journals@aip-info.org to your address book and safe senders list. If you no longer wish to receive emails from us then please unsubscribe or amend your settings. Privacy Policy