Thermal Transport in 2D Materials – Now Open for Submissions!

Submit to this Special Topic today View in Browser SUBMIT AN ARTICLE MANAGE MY ALERTS ABOUT THE JOURNAL Journal of Applied Physics Call for Papers Special Topic: Thermal Transport in 2D Materials There are many applications of 2D materials in nanodevices due to their excellent properties such as ultrahigh carrier mobility and thermal conductivity. Thermal management is critical for reliability and overall performance of the next generation of nanoelectronic power devices. The excellent thermoelectric properties exhibited by 2D materials suggest potential applications in energy conversion.  Fundamental insights into the thermal transport behaviors of 2D materials are important for informing effective heat dissipation strategies of 2D material-based nanoelectronics, and are critical for evaluating other thermal-related factors such as thermoelectric coefficients. Further exploration of phonon transport in 2D materials can also provide theoretical guidance for thermal management design. This Special Topic aims to publish cutting-edge research on the fundamental physical properties, experimental techniques, theoretical simulations, and applications related to thermal transport in 2D materials. Topics covered include, but are not limited to: • Experimental Techniques: Presenting state-of-the-art experimental methods for characterizing thermal transport in 2D materials. • Phonon Transport: Investigating the phonon dispersion, phonon coupling (magnon, electron), and phonon scattering that determine the thermal conductivity in 2D materials; phonon scattering in interface of the heterostructure • Anisotropy and Size Effects: Investigating the impact of anisotropy and size effects on the thermal transport of 2D materials. • Defects and Interfaces: Exploring the role of defects (point and topological defects, grain boundary, etc.) in tuning thermal transport. • Theoretical Models: Investigating thermal transport in 2D materials by theoretical and computational methods. Efforts aimed at advancing predictive models and exploring innovative methodologies like high-throughput calculations and machine learning for accurate describing the thermal transport behaviors will be highly encouraged. • Applications: Highlighting the application potential of 2D materials in thermal-related applications such as thermal management devices, thermoelectric devices and thermal insulation. Guest Editors Minglei Sun, University of Antwerp Kai Ren, Nanjing Forestry University Submission Deadline: May 31, 2024 LEARN MORE > Tell Us What You Think! Did you like this email? Yes > No >  Follow us on social media Copyright © 2023 AIP Publishing. All rights reserved. 1305 Walt Whitman Rd., Melville, NY 11747 You are receiving this email because you have opted-in to receive alerts from us. To guarantee delivery of this email please add journals@aip-info.org to your address book and safe senders list. If you no longer wish to receive emails from us then please unsubscribe or amend your settings.