Thermal Transport in Micro/Nanostructured Materials and Devices – Now Open for Submissions!

Submit to this Special Topic today View in Browser SUBMIT AN ARTICLE MANAGE MY ALERTS ABOUT THE JOURNAL Journal of Applied Physics Call for Papers Special Topic: Thermal Transport in Micro/Nanostructured Materials and Devices As the world shifts towards cleaner solutions with higher efficiency, thermal transport and management are becoming increasingly more important to the success of next-generation information and energy technologies. This Special Topic will collect recent understanding and optimization of thermal transport in micro- and nanostructured materials and devices which are key to reducing energy loss, boosting performance, and significantly lowering our carbon footprint. Topics covered include, but are not limited to: • Numerical simulation of multiscale heat transfer • Microchannel heat exchanger • Phase change at micro/nanoscale • Heat transport at interface • Thermal transport in functional materials • Emerging technologies and fundamentals mechanisms in related topics Guest Editors Wei Wang, Peking University Ronggui Yang, Peking University Bai Song, Peking University Chi Zhang, Peking University Submission Deadline: September 30, 2025 LEARN MORE > Tell Us What You Think! Did you like this email? Yes > No >  Follow us on social media   Copyright © 2025 AIP Publishing. All rights reserved. 1305 Walt Whitman Rd., Melville, NY 11747 You are receiving this email because you have opted-in to receive alerts from us. To guarantee delivery of this email please add journals@aip-info.org to your address book and safe senders list. If you no longer wish to receive emails from us then please unsubscribe or amend your settings. Privacy Policy